Final Mobile Repair Technician Exam — Answer Key Part 4

EivoTech Laptop & Mobile Repair Master Course

Final Mobile Repair Technician Exam — Answer Key Part 4

Questions 121–160 Complete Answers


Section I — Battery Drain + Heating + Shutdown Continued

Question 121

Airplane mode battery drain ko dramatically improve karta hai. Kis subsystem ki direction strong hai?

Answer:

Strong direction:

CELLULAR / RF / NETWORK ACTIVITY

Airplane mode usually cellular radio activity ko disable karta hai.

Agar drain dramatically improve ho:

Check:

  • Weak network signal

  • Constant network searching

  • Antenna path

  • Cellular RF subsystem

  • Carrier/network behavior

Important:

Iska matlab automatically PA faulty nahi.

Pehle network/antenna conditions verify karo.

Golden Rule:

AIRPLANE MODE SOLVES DRAIN → WIRELESS/RF DIRECTION STRONG


Question 122

Phone idle mein warm hai. Airplane mode se koi difference nahi. Software background usage bhi normal. Next direction?

Answer:

Ab hardware leakage/active rail direction stronger hoti hai.

Diagnostic thinking:

SLEEP STATE → ACTIVE RAIL → ABNORMAL LOAD → ROOT CAUSE

Check:

  • Phone actually sleep mein ja raha hai?

  • Any secondary rail unnecessarily active?

  • Liquid/corrosion history?

  • External module leakage?

  • Abnormal rail resistance?

Thermal location clue use ho sakta hai, lekin hottest component ko direct faulty mat bolo.


Question 123

Short aur leakage mein difference explain karo.

Answer:

Hard Short

Very low-resistance unwanted path.

Possible:

Rail almost directly ground/load ki taraf pulled.

Symptoms:

  • Very low resistance

  • High abnormal input load

  • Rail fail/protection

Leakage

Partial unwanted current path.

Resistance hard short jitni low zaroori nahi.

Symptoms:

  • Battery drain

  • Idle heating

  • Sleep current high

  • Intermittent instability

Simple Formula:

SHORT = STRONG UNWANTED CURRENT PATH

LEAKAGE = SMALLER/PARTIAL UNWANTED CURRENT PATH


Question 124

PMIC hottest component hai. Why is that not enough to replace PMIC?

Answer:

PMIC multiple downstream rails ko power deta hai.

Agar downstream load short/leak ho:

PMIC excessive current deliver karte hue warm ho sakta hai.

Possible root causes:

  • Shorted capacitor

  • Camera module

  • Audio amp

  • RF load

  • Corrosion

  • Other peripheral

Correct process:

HOT PMIC → CHECK OUTPUT RAILS → FIND ABNORMAL LOAD

Rule:

HEAT LOCATION = CLUE, NOT FINAL DIAGNOSIS


Question 125

Phone only camera use par shutdown karta hai. Known-good battery se same. First subsystem-specific checks?

Answer:

Focus:

CAMERA SUBSYSTEM

Check:

  1. Which camera triggers shutdown?

  2. Known-good camera module

  3. Camera power rails

  4. Camera PMIC/output

  5. Rail behavior when camera activates

  6. First Falling Point

If one camera replacement solves:

Original camera module strong root cause.


Question 126

Phone only cellular call par restart karta hai. Known-good battery fixes. Root cause?

Answer:

WEAK / DEGRADED BATTERY UNDER RF LOAD

Cellular transmit can create high dynamic power demand.

Old battery idle mein normal lag sakti hai but load par voltage sag kar sakti hai.

Confirmation:

Known-good battery → call stable.

Strong battery fault confirmation.


Question 127

Known-good battery same fault. RF supply collapses first. Root direction?

Answer:

Strong direction:

RF SUPPLY / RF LOAD / PA POWER PATH

Because battery ruled out aur first falling point RF rail hai.

Next conceptual checks:

  • RF regulator/input

  • Enable/control

  • Output rail loading

  • PA/FEM-related load

  • RF power path

Golden Rule:

FIRST FALLING RAIL ROOT-CAUSE AREA KO NARROW KARTI HAI


Section J — Schematic + BoardView + Oscilloscope

Question 128

Schematic aur BoardView ka difference explain karo.

Answer:

Schematic

Electrical relationship dikhata hai.

Batata hai:

  • Component kis net par hai

  • Signal kahan se aata hai

  • Kahan jata hai

  • Circuit blocks ka relation

BoardView

Motherboard par component ki:

PHYSICAL LOCATION

dikhata hai.

Simple:

SCHEMATIC = ELECTRICAL MAP

BOARDVIEW = PHYSICAL MAP

Dono saath use karna best hai.


Question 129

Reference designators ka meaning likho.

Answer:

Common designators:

R = Resistor

C = Capacitor

L = Inductor / Coil / sometimes Ferrite

U = Integrated Circuit / IC

Q = Transistor / MOSFET

D = Diode

F = Fuse

J = Connector / Jack

Manufacturer naming slightly differ kar sakti hai.


Question 130

Last Good → First Missing method example ke saath explain karo.

Answer:

Is method mein signal/power flow ko sequence mein trace karte hain.

Example:

Regulator circuit:

VIN = present.

EN = present.

OUT = missing.

Then:

LAST GOOD = EN / INPUT STAGE

FIRST MISSING = OUTPUT

Ab regulator/output-load area diagnose karenge.

Purpose:

Random IC guessing ki jagah fault ko exact stage tak narrow karna.


Question 131

Regulator output missing hai. Schematic se diagnostic path kaise trace karoge?

Answer:

Master formula:

VIN → EN → OUT → PGOOD → LOAD

Steps:

  1. Regulator identify.

  2. VIN source trace.

  3. Enable source trace.

  4. Output net identify.

  5. Output consumers inspect.

  6. Output rail resistance compare.

  7. PGOOD/feedback where applicable check.

Example:

VIN missing → upstream.

EN missing → control.

VIN + EN good, output missing → output regulator/load direction.


Question 132

Oscilloscope multimeter se kab better hota hai? Kam az kam 5 examples.

Answer:

Oscilloscope useful jab signal time ke saath rapidly change karta ho.

Examples:

  1. Clock signal

  2. Reset pulse

  3. Startup rail pulse

  4. Enable timing

  5. Boot-loop rail collapse

  6. I2C activity

  7. PWM

  8. Voltage ripple

  9. First Falling Point

  10. Short transient events

Simple:

MULTIMETER = STATIC/AVERAGE

SCOPE = TIME-BASED BEHAVIOR


Question 133

Multimeter rail par low unstable voltage show karta hai. Scope par rail correct level tak briefly rise karke collapse karti hai. Is se kya clue milta hai?

Answer:

Multimeter average reading misleading thi.

Scope proves:

REGULATOR ACTUALLY START KAR RAHA HAI

Rail initially correct level achieve karti hai, then shutdown/collapse hoti hai.

Next investigate:

  • Load

  • Protection

  • Enable behavior

  • First Falling Point


Question 134

Enable first drops, phir output rail girti hai. Upstream ya downstream direction?

Answer:

Strong direction:

UPSTREAM CONTROL / SHUTDOWN COMMAND

Because regulator ko pehle disable kiya gaya.

Sequence:

EN ↓

Then VOUT ↓

Regulator may simply be following command.


Question 135

Output rail collapses while enable remains active. Direction?

Answer:

Strong direction:

REGULATOR / OUTPUT LOAD SIDE

Possible:

  • Excessive load

  • Short/leak

  • Regulator failure

  • Protection/current limiting

Because control still requests rail ON.


Question 136

I2C activity scope par nazar aa rahi hai. Kya iska matlab data 100% correct hai?

Answer:

Nahi.

Activity proves bus par transitions ho rahi hain.

But it doesn't automatically prove:

  • Correct address

  • Correct data

  • Proper acknowledgements

  • Timing completely valid

  • Device response correct

For deeper protocol interpretation:

Logic/protocol analysis may be required.

Rule:

ACTIVITY ≠ VALID COMMUNICATION


Question 137

Normal oscilloscope se actual Wi-Fi/cellular GHz RF fully diagnose kyun nahi hoti?

Answer:

Wi-Fi/cellular RF signals very high-frequency radio domain mein operate karte hain.

Normal motherboard scope:

  • Required RF bandwidth na rakhe

  • RF power/frequency accurately analyze na kare

  • Impedance/matching measurement ke liye designed na ho

Advanced RF diagnosis may require:

  • Spectrum analyzer

  • Network analyzer

  • RF test equipment

Lesson:

Normal scope ko GHz RF analyzer mat samjho.


Section K — BGA + Sandwich + Foldable / Tablet

Question 138

BGA ka full form kya hai?

Answer:

BALL GRID ARRAY

IC ke solder connections package ke neeche grid form mein hoti hain.


Question 139

BGA ko last-stage suspect kyun rakhna chahiye?

Answer:

Because BGA/major IC work:

  • High risk

  • Difficult

  • Expensive

  • Board/data damage risk

  • Unnecessary ho sakta hai if easier fault exists

Pehle prove karo:

POWER → CLOCK → RESET → COMMUNICATION → EXTERNAL PATH → PCB PATH

Then BGA.


Question 140

Random reflow ko diagnosis kyun nahi keh sakte?

Answer:

Heat multiple variables change karti hai:

  • Solder expansion

  • PCB expansion

  • IC temperature

  • Leakage

  • Nearby components

Temporary behavior change root cause prove nahi karta.

Rule:

HEAT RESPONSE ≠ BGA CONFIRMATION


Question 141

Heat se behavior temporarily change ho jaye to kya BGA confirm ho gaya?

Answer:

Nahi.

Possible causes:

  • BGA joint

  • Internal IC issue

  • PCB micro-crack

  • Nearby component

  • Temperature-dependent leakage

More evidence needed.


Question 142

UFS BGA ko suspect karne se pehle kaun se prerequisites prove karoge?

Answer:

Check:

  1. UFS power rails

  2. Reset

  3. Required clock

  4. SoC startup

  5. Power stability

  6. Official flash/restore behavior

  7. External cable/PC/software causes

  8. PCB path where measurable

Then storage IC/BGA becomes valid late-stage suspect.


Question 143

No Service phone mein baseband info present aur signal weak hai. Baseband BGA ya antenna/RF first?

Answer:

ANTENNA / RF PATH FIRST

Baseband information present means digital baseband subsystem significantly alive.

Weak signal strongly points toward:

  • Antenna contact

  • Coax

  • Filter

  • LNA/FEM

  • RF path


Question 144

Wi-Fi weak hai but toggle and Bluetooth digital functions normal. Wi-Fi BGA ya RF first?

Answer:

RF / ANTENNA FIRST

Feature initializes normally.

Weak range is typically RF path problem before combo IC BGA.


Question 145

Sandwich/interposer fault ko suspect karne ke strong clues kya hain?

Answer:

Strong clues:

  • Hard-drop history

  • Multiple related intermittent faults

  • External modules ruled out

  • Source-side signals present

  • Destination-side signals missing

  • Multiple affected nets cross same interposer region

  • Board-to-board path instability

Rule:

INTERPOSER FAULT = EVIDENCE-BASED LATE-STAGE CONCLUSION


Question 146

Hard drop ke baad No Service aaya. Board separate karne se pehle kya-kya check karoge?

Answer:

First check:

  1. Known-good SIM

  2. SIM detection

  3. Baseband information

  4. Antenna contacts

  5. Coax cables

  6. RF connectors

  7. RF front-end

  8. Baseband power/control

  9. Visible board damage

Board separation first diagnostic step nahi.


Question 147

Foldable phone inner display dead hai but outer display works. Diagnostic block?

Answer:

Strongly localized to:

INNER DISPLAY SUBSYSTEM

Check:

  • Inner panel

  • Inner display connector

  • Hinge flex/interconnect

  • Inner display power

  • Reset/data path

Outer display working suggests complete SoC/display engine failure less likely.


Question 148

Foldable phone sirf half-fold position par restart karta hai. Strong suspect area?

Answer:

HINGE FLEX / INTERCONNECT / POSITION-DEPENDENT MECHANICAL PATH

Possible:

  • Battery interconnect

  • Display flex

  • Main-to-secondary board path

  • Hinge wiring

Do not repeatedly stress/flex device unnecessarily.


Question 149

Dual-battery device mein one battery not detected. Kin lines/systems ko check karoge?

Answer:

Check:

  • Battery module connector

  • Battery positive/ground path

  • Temperature sensing

  • ID/data lines

  • Battery-detection communication

  • Power-management system

Known-good compatible pack comparison can help.


Question 150

Dual battery packs ko manually parallel/direct-charge kyun nahi karna chahiye?

Answer:

Dual-battery architecture can use sophisticated protected power-management.

Manual cell connection/direct charging can bypass:

  • BMS/protection

  • Temperature monitoring

  • Charge balancing/control

  • Device-specific limits

Result dangerous battery damage/overheating ho sakta hai.

Rule:

COMPLETE PROTECTED BATTERY MODULES KO USE KARO — CELLS KO MANUALLY MODIFY NAHI


Question 151

Tablet finger touch works but stylus dead. Kis subsystem ko separately diagnose karna hai?

Answer:

STYLUS / ACTIVE DIGITIZER SUBSYSTEM

Check:

  • Known-good compatible stylus

  • Stylus power/accessory state

  • Digitizer controller

  • Digitizer power

  • Communication

Finger capacitive touch working stylus digitizer ko automatically prove nahi karta.


Question 152

Tablet charges normally but external USB-C display output dead. Kya charging path automatically high-speed path ko prove karta hai?

Answer:

Nahi.

USB-C port mein separate functions ho sakte hain:

  • VBUS charging

  • CC

  • USB data

  • High-speed lanes

  • DisplayPort Alt Mode

  • Mux

Charging working only power-related path significantly prove karta hai.

External display failure mein check:

  • Device feature support

  • Cable/adapter

  • USB mux/control

  • High-speed path


Final Master Oral Questions

Question 153

Aap ke paas ek completely unknown dead phone aaye. First 10 diagnostic steps verbal sequence mein batao.

Answer:

Professional sequence:

1.

Customer complaint verify karo.

2.

History lo:

Drop, liquid, previous repair, charging event.

3.

Physical inspection.

4.

Known-good compatible battery/input test.

5.

Confirm whether phone truly no-power hai ya no-display.

6.

Main battery rail check.

7.

Main-rail resistance/short check with power removed.

8.

PMIC input check.

9.

Always-on/standby rails check.

10.

Power-key → startup rails → CPU/RAM/storage boot sequence trace karo.

Then:

LAST GOOD → FIRST MISSING


Question 154

Aapko ek unknown rail par continuity beep milti hai. Is reading ko interpret karne ka complete process batao.

Answer:

Direct “short” mat bolo.

Process:

  1. Exact net identify.

  2. Board power remove.

  3. Resistance-to-ground measure.

  4. Determine rail type.

  5. Ask whether naturally low-resistance rail hai.

  6. Known-good same-model compare.

  7. BoardView par consumers map.

  8. Other same-net capacitors compare.

  9. Boot/function behavior consider.

  10. Only evidence ke baad short confirm.

Golden Rule:

BEEP → INVESTIGATE

not:

BEEP → SHORT CONFIRMED


Question 155

Customer kehta hai: “Phone ka motherboard short hai.” Aap technician ke taur par is statement ko kaise verify karoge?

Answer:

Customer complaint ko diagnosis nahi samjho.

First determine actual symptom:

  • No power?

  • No charge?

  • Heating?

  • Battery drain?

Then:

  1. Known-good external tests

  2. Power removed

  3. Main rail resistance

  4. Compare known-good

  5. Exact affected rail identify

  6. Net map

  7. Branch isolate

  8. Root component confirm

Formula:

CUSTOMER STATEMENT → VERIFIED SYMPTOM → ELECTRICAL EVIDENCE → DIAGNOSIS


Question 156

Ek phone repair ke baad ON ho gaya. Kya repair complete hai? Full QC ka reason explain karo.

Answer:

Nahi.

Phone ON hona only one condition prove karta hai.

Repair ke baad check:

  • Charging

  • Display/touch

  • Audio

  • Cameras

  • Network

  • Wi-Fi/Bluetooth

  • Sensors

  • Buttons

  • Battery/thermal

  • Original complaint

Especially liquid/board repair mein multiple faults ho sakte hain.

Rule:

REPAIR COMPLETE = ROOT CAUSE FIXED + FULL QC PASSED


Question 157

“Current draw 0.xxA = UFS fault.” Is statement mein technical problem kya hai?

Answer:

Current value:

UNIVERSAL FAULT CODE NAHI

Same current reading different phones/states mein different meaning rakh sakti hai.

Current depends on:

  • Model

  • SoC

  • Boot stage

  • Display

  • Firmware

  • Peripherals

Correct method:

CURRENT PATTERN → BOOT STAGE → RAIL MEASUREMENTS → FIRST MISSING/FALLING


Question 158

“IC garam hai = IC faulty.” Is statement mein problem kya hai?

Answer:

IC downstream load ko power de raha ho sakta hai.

Heat could result from:

  • Downstream short

  • Heavy normal load

  • Cycling

  • Leakage

  • IC fault

Therefore:

HOT IC = CLUE

Then:

  • Input/output rails

  • Load resistance

  • Isolation

  • Function

check karo.


Question 159

“Phone drop hua = CPU reball.” Is approach mein kya galat hai?

Answer:

Drop can damage many easier things:

  • Display

  • Battery

  • Connector

  • Flex

  • Antenna

  • Coax

  • PCB

  • Solder joints

CPU is only one possible late-stage cause.

Correct order:

PHYSICAL INSPECTION → EXTERNAL MODULE → POWER → SIGNALS → PCB PATH → BGA LAST

Random BGA work unnecessary risk create karta hai.


Question 160

Professional repair technician aur parts-changing technician mein kya difference hai?

Answer:

Parts-Changing Technician

Often:

Symptom dekha.

↓

Part guess kiya.

↓

Replace kiya.

↓

Try kiya.

Professional Diagnostic Technician

Uses:

SYMPTOM → HISTORY → SYSTEM → BLOCK → MEASUREMENT → LAST GOOD → FIRST MISSING → CONFIRMATION → ROOT CAUSE

Professional technician:

  • Measurement record karta hai

  • Schematic use karta hai

  • Known-good comparison karta hai

  • Customer data protect karta hai

  • Major IC ko last suspect rakhta hai

  • Full QC karta hai

Final Difference:

PARTS CHANGER COMPONENT GUESS KARTA HAI

DIAGNOSTIC TECHNICIAN FAULTY STAGE PROVE KARTA HAI


Answer Key Part 4 — Questions 121–160 Complete ✅

Final Theory Answer Key Status

Questions 1–40

✅ Answer Key Part 1

Questions 41–80

✅ Answer Key Part 2

Questions 81–120

✅ Answer Key Part 3

Questions 121–160

✅ Answer Key Part 4

Questions 1–160 Complete ✅


Ab Final Remaining Section

Theory exam complete ho gaya.

Ab sirf:

25 FINAL ADVANCED PRACTICAL CASES — COMPLETE ANSWER KEY

remaining hai.

Usmein har case ko simple answer se nahi, balki proper format mein solve karenge:

SYMPTOM

↓

IMPORTANT CLUE

↓

LAST GOOD

↓

FIRST MISSING / FIRST FALLING

↓

DIAGNOSTIC DIRECTION

↓

CONFIRMATION

↓

ROOT CAUSE

Ye final practical answer key complete hone ke baad:

EivoTech Mobile Repair Master Course + Advanced Extension + Final Exam = FULLY COMPLETE ✅

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